Direct-to-Chip, Row-to-End: The Future of Immersive Cooling Is Here

By Orbis Electric Engineering Team | November 2025

Meeting the Demands of High-Compute AI

With GPUs and AI accelerators pushing heat densities beyond the practical limits of traditional air-cooling capabilities, hyperscalers are turning to liquid-cooling architectures that deliver higher performance at lower operational cost.

Orbis Electric’s HaloDrive™ platform delivers a complete OCP-compliant cooling solution — from direct-to-chip flow control through row-to-end architectures and full-immersion systems, including turnkey immersion tanks for seamless deployment.

An Integrated Cooling Ecosystem

Unlike fragmented systems requiring multiple vendors, Orbis Electric provides a full-solution approach:

• Direct-to-Chip Cooling: Precision AI-orchestrated thermal control at the server level.

• Row-to-End Integration: Continuous fluid circulation through racks, reducing heat build-up and ensuring balanced temperature distribution.

• Direct Immersion Turnkey Systems: End-to-end immersion solutions that eliminate traditional CDU blocks, reduce external pumping requirements, and simplify system plumbing.

Why This Matters

AI data centers are projected to consume over 500 TWh of electricity annually by 2030, and cooling efficiency. HaloDrive™’s integrated motor-pump-VFD architecture cuts those inefficiencies dramatically, turning cooling into an active contributor to compute performance and energy savings.

The Future Is Liquid, Intelligent, and Orbis-Powered

As AI workloads surge, HaloDrive™ stands as the world’s first intelligent Cooling Engine — uniting mechanical, electrical, and computational efficiency in a single, drop-in system that’s ready for next-generation AI infrastructure.